VisIC Technologies at Scape 2024
SCAPE 2024, International Wide-Bandgap Power Electronics Application Workshop – www.scape2024.se
Panel Subject: Power Module Packaging Technologies & Designs: actual solutions and future trends
Who: Dieter Liesabeths, SVP of Product, will talk about about: “GaN power devices and power modules”
When: May 14-15, (09:00-18:50, 09:00-16:00)
Location: Grand Hotel Saltsjöbaden, Stockholm
The presentation will concentrate of the integration of D3GAN technology in todays power module form factor and the constraint arising from fast switching devices.
The GaN-on-Silicon HEMT transistors need’s a different approach as it has a lateral current flow compared to the conventional Si-IGBT and SiC-Mosfets which has a vertical current flow and therefore needs a different integration support.