Management Team

Dr. Tamara Baksht

Dr. Tamara Baksht

Founder, CEO

Tamara’s background education and work experience are from Tomsk State University in Russia with a Ph.D. in Electrical Engineering from Tel Aviv University and further work at Gal El (MMIC). Tamara has 8 years of experience running multi-disciplinary GaN projects, defining work plans, budgeting, reporting, transferring products to production and providing customer support. Tamara received grants from the Chief Science Office, MAFAT, and BIRD Foundation. The last major pre-VisIC achievement was the completion of Phase I of a multi-million USD, multi-year GaN program in August 2009, one year ahead of the initial schedule.

Gregory Bunin

Gregory Bunin

Founder, CTO

Gregory’s background education and work experience were in Moscow, Russia at leading semiconductor centers, MIET & PULSAR. In Israel, Gregory worked in the Weizmann Institute of Science, ELTA and Gal El (MMIC). Gregory has more than 30 years’ experience in compound semiconductor technology development, including more than 20 years’ experience in the management of multi-disciplinary research and development teams. Gregory’s last pre-VisIC major achievement was completing the design of a state-of-the-art GaN RF high power amplifier in October 2009. The design met all customer specifications.

Ran Soffer

Ran Soffer

Chief Strategy Officer

Ran Soffer is a semiconductor industry veteran with more than 20 years of senior management experience in positions from the startup companies through to Fortune 500 enterprises. Mr. Soffer most recently served as Vice President of Marketing and Corporate Development at Ceva. He also served as General Manager of the Microwave Business Unit at Broadcom, following its acquisition of Provigent in 2011, where he served as Vice President of Marketing and Product Management. Earlier he served as Director of Product Management for Metalink and in various engineering and leadership positions at Motorola, Redux, and ECI. Ran Soffer wrote and holds more than 15 patents and also earned an M.B.A, and M.Sc. in Electrical Engineering from the Israel Institute of Technology.

Ortal Zanzuri

Ortal Zanzuri

CFO

Hands on CFO brings over a 15 years experience in finance management for startups and multinational public companies. Experienced in building from zero and developing finance departments, fund raising, budgeting, cash flow management, financial reporting, implementing ERP systems and collection.

Ran Klier

Ran Klier

VP of Global Sales & Marketing

Ran has been part of the semiconductor industry for over 25 years, bringing
with him a vast wealth of experience. He was CPO of DSP Group until its
acquisition by Synaptics, and previous to that was GM for DSP’s Unified
Communications & Collaboration as well as for its Hearables Business.
Ran initially joined DSP Group as its Chief System-on-a-Chip Architect and
has since served in numerous executive sales and marketing roles within
the group, including VP of Sales and Business Development for Europe and
the Americas, and VP of Cordless and VoIP Product Line Management.
In 2005, Ran relocated to Hong Kong where he served as VP of Strategic
Accounts for the Asia-Pacific region, looking after DSP’s regional projects
and providing local support for the group’s APAC customers for the next
five years.
Prior to working with DSP Group, Ran has held positions in engineering at
the National Semiconductor and Intel Design Centers in Israel. He has an
MBA with honors from Tel Aviv University and a BSc with highest honors in
electrical engineering from the Israeli Institute of Technology, Technion.

Dr. Simon Wainwright

Dr. Simon Wainwright

VP of Operations

Simon Wainwright received his B.Eng (hons) in Electronic Engineering from the University of Liverpool, UK graduating in 1991 This was followed by a Ph.D. in 1995 with his thesis based on “Silicon On Insulator (SOI) Technology” from the same University. Following a brief spell as an associate professor at the University of the Basque Country in Northern Spain, Dr. Wainwright moved into industry with FAGOR Electronica. Here he was involved in wafer fab engineering and development of power discretes such as power diodes for the automotive market but also heavy-duty SCRs, DIACs, and TRIACs for the industrial markets. During this period, he obtained an MBA from the University of Deusto in San Sebastian.

Dr. Daniel Sherman

Dr. Daniel Sherman

VP of R&D

Daniel is a physicist, EE, and a semiconductor professional. He began his career in the technological branch of the signal intelligence unit, where he held leading roles for over seven years. Soon after, Daniel completed his Ph.D. in physics, followed by a research fellowship in a Microsoft Research lab at the Niels Bohr Institute in Copenhagen. Daniel published several key scientific results in journals such as Nature Physics (rated at the 98th percentile of all equivalent publications to date) and Nature Nanotechnology. Moving to industry, Daniel worked for more than seven years in two separate terms at Intel, in silicon reliability and product development. He also brings experience from TowerJazz R&D, owning device development in Israeli and Japanese fabs, which subsequently won strategic customers. Daniel wrote and holds several patents in power electronics.

Dr. Kurt V. Smith

Dr. Kurt V. Smith

VP of Reliability and Qualification

Kurt has 18 years of experience in Gallium Nitride Reliability. He has worked on RF GaN devices at Raytheon, supporting reliability analysis of high power RF amplifiers for radar and other high frequency applications. More recently, Kurt was the Reliability Manager at Transphorm, working on high voltage GaN power devices. He was responsible for reliability testing, analysis and degradation models to support both physical understanding of factors contributing to the reliability of devices and customer requests for specialized testing and understanding. He contributed to the successful JEDEC and automotive qualification of Transphorm’s GaN products.
Kurt is currently a member of the leadership team for the JEDEC J70 efforts to develop standards for GaN and SiC testing, datasheets and reliability.

Memo Romero

Memo Romero

VP of Packaging

Memo is a Power Electronics Packaging expert and Entrepreneur.   He has almost 30 years of experience in advanced thermo-mechanical packaging, with a focus on high power module design, simulation, and technical innovation.  A graduate of MIT and Stanford, he holds over 20 US patents and numerous publications related to advanced power electronic packaging.  Memo has held senior-level engineering positions at Motorola, Semipower Systems, and Amulaire Thermal Technology.   He has founded several companies, including MaxQ Technology where his designs have flown on three NASA missions, Athena 3D Manufacturing, and his own technology consulting company, Innoventa LLC.   He was also principal at Rinehart Motion Systems LLC (now Cascadia Motion), an Oregon based advanced power electronics company.   He is an experienced and proven self-starter that combines exceptional design and analytical skills with business acumen and start-up management experience.

Dima Novo

Dima Novo

VP of Power Electronics

Dima Novo received his B. Sc. In Electronic Engineering from the University of Ben Gurion in Bee-Sheba, IL. Dima has vast experience in the design and management of large-scale power and power electronics projects. His previous experience includes design, commissioning, and troubleshooting of large scale electrical systems and state of the art green energy power stations. Leading multi-disciplinary teams from conceptual design up to manufacturing and commissioning.

 

Lev Stessin

Lev Stessin

Senior Adviser Packaging Strategy

Lev has 47 years in production and design of power semiconductor products. Started as process engineer on Si FAB in Moscow, Russia. Made his way to Manager of department of yield enhancement in semiconductor production division of Pulsar Company, Moscow, Russia. After immigration in Israel joined Microwave division of ELTA Systems, a Subsidiary of Israel Aerospace Industry. Worked on development and production of state of the art microwave devices and Transmit/Receive modules. Finished his work at ELTA as a Chief of technology of MW division of ELTA Systems. Joined VisIC on 2011 as VP Packaging. Develops of VisIC packaging technology as well as innovative die topology.