Dr. Tamara Baksht
Tamara’s background education and work experience are from Tomsk State University in Russia with a Ph.D. in Electrical Engineering from Tel Aviv University and further work at Gal El (MMIC). Tamara has 8 years of experience running multi-disciplinary GaN projects, defining work plans, budgeting, reporting, transferring products to production and providing customer support. Tamara received grants from the Chief Science Office, MAFAT, and BIRD Foundation. The last major pre-VisIC achievement was the completion of Phase I of a multi-million USD, multi-year GaN program in August 2009, one year ahead of the initial schedule.
Gregory’s background education and work experience were in Moscow, Russia at leading semiconductor centers, MIET & PULSAR. In Israel, Gregory worked in the Weizmann Institute of Science, ELTA and Gal El (MMIC). Gregory has more than 30 years’ experience in compound semiconductor technology development, including more than 20 years’ experience in the management of multi-disciplinary research and development teams. Gregory’s last pre-VisIC major achievement was completing the design of a state-of-the-art GaN RF high power amplifier in October 2009. The design met all customer specifications.
SVP Sales & Marketing
Ran Soffer is a semiconductor industry veteran with more than 20 years of senior management experience in positions from the startup companies through to Fortune 500 enterprises. Mr. Soffer most recently served as Vice President of Marketing and Corporate Development at Ceva. He also served as General Manager of the Microwave Business Unit at Broadcom, following its acquisition of Provigent in 2011, where he served as Vice President of Marketing and Product Management. Earlier he served as Director of Product Management for Metalink and in various engineering and leadership positions at Motorola, Redux, and ECI. Ran Soffer wrote and holds more than 15 patents and also earned an M.B.A, and M.Sc. in Electrical Engineering from the Israel Institute of Technology.
Hands on CFO brings over a 15 years experience in finance management for startups and multinational public companies. Experienced in building from zero and developing finance departments, fund raising, budgeting, cash flow management, financial reporting, implementing ERP systems and collection.
Dr. Simon Wainwright
VP of Operations
Simon Wainwright received his B.Eng (hons) in Electronic Engineering from the University of Liverpool, UK graduating in 1991 This was followed by a Ph.D. in 1995 with his thesis based on “Silicon On Insulator (SOI) Technology” from the same University. Following a brief spell as an associate professor at the University of the Basque Country in Northern Spain, Dr. Wainwright moved into industry with FAGOR Electronica. Here he was involved in wafer fab engineering and development of power discretes such as power diodes for the automotive market but also heavy-duty SCRs, DIACs, and TRIACs for the industrial markets. During this period, he obtained an MBA from the University of Deusto in San Sebastian.
Dr. Daniel Sherman
VP of Semiconductor R&D
Daniel is a semiconductor specialist. He began his professional career in the technological branch of the national intelligence unit, where he held leading roles for over 7 years. Soon after, Daniel completed his Ph.D. in physics which was followed by a research fellowship in a Microsoft Research lab, at the Niels Bohr Institute in Copenhagen. During his research, he published several key scientific results in journals such as Nature Physics (this one is rated at the 98th percentile of all equivalent scientific publications to date) and Nature Nanotechnology. Daniel worked for more than 7 years in two sperate terms at Intel, also as the program lead of 7nm and 10nm product reliability. He also brings experience from TowerJazz R&D, owning the device and process development in the Israeli and Japanese fabs and related patent of key power devices which subsequently brought strategic customers to the company.
Kurt V. Smith
VP of Reliability and Qualification
Kurt has 18 years of experience in Gallium Nitride Reliability. He has worked on RF GaN devices at Raytheon, supporting reliability analysis of high power RF amplifiers for radar and other high frequency applications. More recently, Kurt was the Reliability Manager at Transphorm, working on high voltage GaN power devices. He was responsible for reliability testing, analysis and degradation models to support both physical understanding of factors contributing to the reliability of devices and customer requests for specialized testing and understanding. He contributed to the successful JEDEC and automotive qualification of Transphorm’s GaN products.
Kurt is currently a member of the leadership team for the JEDEC J70 efforts to develop standards for GaN and SiC testing, datasheets and reliability.
VP of Packaging
Memo is a Power Electronics Packaging expert and Entrepreneur. He has almost 30 years of experience in advanced thermo-mechanical packaging, with a focus on high power module design, simulation, and technical innovation. A graduate of MIT and Stanford, he holds over 20 US patents and numerous publications related to advanced power electronic packaging. Memo has held senior-level engineering positions at Motorola, Semipower Systems, and Amulaire Thermal Technology. He has founded several companies, including MaxQ Technology where his designs have flown on three NASA missions, Athena 3D Manufacturing, and his own technology consulting company, Innoventa LLC. He was also principal at Rinehart Motion Systems LLC (now Cascadia Motion), an Oregon based advanced power electronics company. He is an experienced and proven self-starter that combines exceptional design and analytical skills with business acumen and start-up management experience.
Senior Adviser Packaging Strategy
Lev has 47 years in production and design of power semiconductor products. Started as process engineer on Si FAB in Moscow, Russia. Made his way to Manager of department of yield enhancement in semiconductor production division of Pulsar Company, Moscow, Russia. After immigration in Israel joined Microwave division of ELTA Systems, a Subsidiary of Israel Aerospace Industry. Worked on development and production of state of the art microwave devices and Transmit/Receive modules. Finished his work at ELTA as a Chief of technology of MW division of ELTA Systems. Joined VisIC on 2011 as VP Packaging. Develops of VisIC packaging technology as well as innovative die topology.