VisIC Technologies Ensures Supply Chain Resilience Amid TSMC GaN Changes
As part of VisIC’s long-term strategic planning, the company has been actively developing and qualifying new foundry partners for over two years. These partnerships are focused on 8″ wafer production capabilities and are designed to ensure a robust, resilient, and scalable supply chain that supports the increasing demand for GaN power devices in the automotive and industrial sectors.
“TSMC’s decision was not unexpected, and we have been preparing for this scenario well in advance,” said Tamara Baksht, CEO of VisIC Technologies. “For the past two years, our team has worked intensively to establish a multi-source manufacturing strategy. We are proud to be ahead of the curve with multiple qualified suppliers, ensuring continuity, reliability, and scalability for our customers.”
The transition to 8″ wafers offers significant benefits, including enhanced manufacturing capacity and cost efficiencies—critical elements for mass-market automotive applications. VisIC’s new foundry partners have already begun production ramp-up, with first products available for customer evaluation and integration by the beginning of 2026.
VisIC remains fully committed to supporting its existing customers during the transition phase and assures that all future GaN solutions will continue to meet the company’s stringent performance and quality standards.
Press contact:
Dieter Liesabeths
SVP of Product
Dieter@visic-tech.com